W. M. de Azevedo; I. L. de Mattos; M. Navarro
W. M. de Azevedo; I. L. de Mattos; M. Navarro
Phase structure and dielectric property of the ZnNb2O6–(Mg0.3Zn0.7)TiO3multiphase ceramics [0.03%]
ZnNb2O6–(Mg0.3Zn0.7)TiO3复相陶瓷的相结构与介电性能
Xiang Chun Liu; Jun Ping Deng
Xiang Chun Liu; Jun Ping Deng
Electrical characteristics and inhomogeneous barrier analysis of aniline green/p-Si heterojunctions [0.03%]
苯胺绿/p型硅异质结的电学特性与非均匀势垒分析
Ö. Güllü; M. Biber; A. Türüt
Ö. Güllü; M. Biber; A. Türüt
Electrochemical capacitance study on Co3O4nanowires for super capacitors application [0.03%]
用于超级电容器应用的Co3O4纳米线的电化学电容研究
Lu Wang; Xiaoheng Liu; Xin Wang; Xujie Yang; Lude Lu
Lu Wang; Xiaoheng Liu; Xin Wang; Xujie Yang; Lude Lu
Development of stable, non-cyanide solutions for electroplating Au-Sn alloy films [0.03%]
用于电镀金锡合金薄膜的稳定、无氰化物溶液的开发
A. He; Q. Liu; D. G. Ivey
A. He; Q. Liu; D. G. Ivey
Fabrication and characteristics of La, Cd and Sn doped BST thin films by sol–gel method [0.03%]
溶胶-凝胶法掺杂La、Cd和Sn的BST薄膜的制备与性能研究
Wencheng Hu; Chuanren Yang; Wanli Zhang
Wencheng Hu; Chuanren Yang; Wanli Zhang
Relation between Kirkendall voids and intermetallic compound layers in the SnAg/Cu solder joints [0.03%]
SnAg/Cu焊点中Kirkendall空洞与金属间化合物层之间的关系
Chun Yu; Yang Yang; Kaiyun Wang; Jijin Xu; Junmei Chen; Hao Lu
Chun Yu; Yang Yang; Kaiyun Wang; Jijin Xu; Junmei Chen; Hao Lu
Electrical reliability of different alloying content on copper alloy fillers in electrically conductive adhesives [0.03%]
导电胶中不同合金含量铜合金填料的电气可靠性
Li-Ngee Ho; Teng Fei Wu; Hiroshi Nishikawa; Tadashi Takemoto; Koichi Miyake; Masakazu Fujita; Koyu Ota
Li-Ngee Ho; Teng Fei Wu; Hiroshi Nishikawa; Tadashi Takemoto; Koichi Miyake; Masakazu Fujita; Koyu Ota
Interfacial reactions of Sn-3.5% Ag and Sn-3.5% Ag-0.5% Cu solder with electroless Ni/Au metallization during multiple reflow cycles [0.03%]
多次回流焊接过程中，Sn-3.5% Ag和Sn-3.5% Ag-0.5% Cu焊料与化学镀Ni/Au金属化层之间的界面反应
Ahmed Sharif; Y. C. Chan
Ahmed Sharif; Y. C. Chan
Suppression of Cu3Sn and Kirkendall voids at Cu/Sn-3.5Ag solder joints by adding a small amount of Ge [0.03%]
通过添加少量锗，可抑制铜/锡-3.5银焊点中Cu3Sn和柯肯达尔空洞的形成。
Chun Yu; Yang Yang; Peilin Li; Junmei Chen; Hao Lu
Chun Yu; Yang Yang; Peilin Li; Junmei Chen; Hao Lu