Journal of materials science-materials in electronics. 2008;19(12):1197-1201. doi: 10.1007/s10854-007-9527-7 Q23.22025

Fabrication and characteristics of La, Cd and Sn doped BST thin films by sol–gel method

溶胶-凝胶法掺杂La、Cd和Sn的BST薄膜的制备与性能研究

DOI: 10.1007/s10854-007-9527-7

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