Journal of materials science-materials in electronics. 2012;23(1):124-129. doi: 10.1007/s10854-011-0516-5 Q23.22025

Relation between Kirkendall voids and intermetallic compound layers in the SnAg/Cu solder joints

SnAg/Cu焊点中Kirkendall空洞与金属间化合物层之间的关系

Chun Yu; Yang Yang; Kaiyun Wang; Jijin Xu; Junmei Chen; Hao Lu

DOI: 10.1007/s10854-011-0516-5

期刊名：Journal of materials science-materials in electronics

缩写：J MATER SCI-MATER EL

ISSN：0957-4522

e-ISSN：1573-482X

IF/分区：3.2/Q2

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