Journal of materials science-materials in electronics. 2005;16(3):153-158. doi: 10.1007/s10854-005-6595-4 Q23.22025

Interfacial reactions of Sn-3.5% Ag and Sn-3.5% Ag-0.5% Cu solder with electroless Ni/Au metallization during multiple reflow cycles

多次回流焊接过程中，Sn-3.5% Ag和Sn-3.5% Ag-0.5% Cu焊料与化学镀Ni/Au金属化层之间的界面反应

DOI: 10.1007/s10854-005-6595-4

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