Journal of materials science-materials in electronics. 2011;22(7):735-740. doi: 10.1007/s10854-010-0202-z Q23.22025

Electrical reliability of different alloying content on copper alloy fillers in electrically conductive adhesives

导电胶中不同合金含量铜合金填料的电气可靠性

Li-Ngee Ho; Teng Fei Wu; Hiroshi Nishikawa; Tadashi Takemoto; Koichi Miyake; Masakazu Fujita; Koyu Ota

DOI: 10.1007/s10854-010-0202-z

期刊名：Journal of materials science-materials in electronics

缩写：J MATER SCI-MATER EL

ISSN：0957-4522

e-ISSN：1573-482X

IF/分区：3.2/Q2

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