Journal of materials science-materials in electronics. 2006;17(1):63-70. doi: 10.1007/s10854-005-5143-6 Q23.22025

Development of stable, non-cyanide solutions for electroplating Au-Sn alloy films

用于电镀金锡合金薄膜的稳定、无氰化物溶液的开发

DOI: 10.1007/s10854-005-5143-6

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