Adhesion characteristics of Cu/Ni–Cr/polyimide flexible copper clad laminates according to Ni:Cr ratio and Cu electroplating layer thickness [0.03%]
根据镍铬比和铜电镀层厚度对Cu/Ni–Cr/聚酰亚胺柔性覆铜板的粘附性能的影响
Bo-In Noh; Jeong-Won Yoon; Bo-Young Lee; Seung-Boo Jung
Bo-In Noh; Jeong-Won Yoon; Bo-Young Lee; Seung-Boo Jung
In situ and ex situ investigation on the annealing performance of the ZnO film grown by ion beam deposition [0.03%]
基于离子束沉积生长的ZnO薄膜的退火性能原位与离位研究
Tao Chen; Shu-Yi Liu; Qi Xie; Christophe Detavernier; R. L. Van Meirhaeghe; Xin-Ping Qu
Tao Chen; Shu-Yi Liu; Qi Xie; Christophe Detavernier; R. L. Van Meirhaeghe; Xin-Ping Qu
UV-cured hybrid inorganic-organic polymer electrolyte based on organically modified polysiloxane [0.03%]
基于有机改性聚硅氧烷的紫外光固化无机-有机杂化聚合物电解质
Wei-li Qiu; Xiao-Hua Ma; Qing-he Yang; Yan-bao Fu; Xiang-fu Zong
Wei-li Qiu; Xiao-Hua Ma; Qing-he Yang; Yan-bao Fu; Xiang-fu Zong
Zero and negative temperature coefficients of resistivity of rapidly solidified Bi–Sn alloys using melt-spinning technique [0.03%]
采用熔体旋铸技术制备的快速凝固铋-锡合金的电阻率零温度系数和负温度系数
Mustafa Kamal; Tarek El-Ashram
Mustafa Kamal; Tarek El-Ashram
Effect of annealing temperature on the microstructural and electrical properties of epitaxial Ga-doped ZnO film deposited on c-sapphire substrate [0.03%]
退火温度对沉积在c-蓝宝石衬底上的外延Ga掺杂ZnO薄膜微观结构和电学性能的影响
Zhiyun Zhang; Chonggao Bao; Qun Li; Shengqiang Ma; Shuzeng Hou
Zhiyun Zhang; Chonggao Bao; Qun Li; Shengqiang Ma; Shuzeng Hou
Electrical, structural and morphological characteristics of rapidly annealed Pd/n-InP (100) Schottky structure [0.03%]
快速退火Pd/n-InP (100) 肖特基结构的电学、结构及形貌特性
A. Ashok Kumar; V. Janardhanam; V. Rajagopal Reddy
A. Ashok Kumar; V. Janardhanam; V. Rajagopal Reddy
Effects of post-deposition annealing temperature and ambient on RF magnetron sputtered Sm2O3gate on n-type silicon substrate [0.03%]
退火温度和环境对射频磁控溅射Sm2O3栅极在n型硅衬底上沉积后的影响
Wen Chiao Chin; Kuan Yew Cheong
Wen Chiao Chin; Kuan Yew Cheong
Innovative methodologies of circuit edit by focused ion beam (FIB) on wafer-level chip-scale-package (WLCSP) devices [0.03%]
晶圆级芯片规模封装（WLCSP）器件中基于聚焦离子束（FIB）的电路编辑创新方法
Tao-Chi Liu; Chih Chen; Shih-Ting Liu; Ming-Lun Chang; Jandel Lin
Tao-Chi Liu; Chih Chen; Shih-Ting Liu; Ming-Lun Chang; Jandel Lin
Effect of Bi content on spalling behavior of Sn–Bi–Zn–Ag/Cu interface [0.03%]
Bi含量对Sn–Bi–Zn–Ag/Cu界面剥落行为的影响
X. Wang; Y. C. Liu; Z. M. Gao
X. Wang; Y. C. Liu; Z. M. Gao
Formation of interfacial structure of Sn–3.7Ag–0.9Zn eutectic solder with different Al additions [0.03%]
不同铝添加量下Sn–3.7Ag–0.9Zn共晶焊料界面结构的形成
C. Wei; Y. C. Liu; J. B. Wan
C. Wei; Y. C. Liu; J. B. Wan