Journal of materials science-materials in electronics. 2009;20(9):885-890. doi: 10.1007/s10854-008-9811-1 Q23.22025

Adhesion characteristics of Cu/Ni–Cr/polyimide flexible copper clad laminates according to Ni:Cr ratio and Cu electroplating layer thickness

根据镍铬比和铜电镀层厚度对Cu/Ni–Cr/聚酰亚胺柔性覆铜板的粘附性能的影响

Bo-In Noh; Jeong-Won Yoon; Bo-Young Lee; Seung-Boo Jung

DOI: 10.1007/s10854-008-9811-1

期刊名：Journal of materials science-materials in electronics

缩写：J MATER SCI-MATER EL

ISSN：0957-4522

e-ISSN：1573-482X

IF/分区：3.2/Q2

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