Journal of materials science-materials in electronics. 2008;19(1):91-96. doi: 10.1007/s10854-007-9315-4 Q23.22025

Zero and negative temperature coefficients of resistivity of rapidly solidified Bi–Sn alloys using melt-spinning technique

采用熔体旋铸技术制备的快速凝固铋-锡合金的电阻率零温度系数和负温度系数

DOI: 10.1007/s10854-007-9315-4

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