Extending Copper Interconnects and Epoxy Dielectrics to Multi-GHz Frequencies [0.03%]
从兆赫兹到吉赫兹的铜互连和环氧介质的研究与发展
Junghyun Park,Jiayou Xu,Anthony Engler et al.
Junghyun Park et al.
Future multichip packages require Die-to-Die (D2D) interconnects operating at frequencies above 10 GHz; however, the extension of copper interconnects and epoxy dielectrics presents a trade-off between performance and reliability. This pape...
Flexible Multielectrode Arrays With 2-D and 3-D Contacts for In Vivo Electromyography Recording [0.03%]
用于在体肌电图记录的具有二维和三维触点的柔性多电极阵列
Muneeb Zia,Bryce Chung,Samuel Sober et al.
Muneeb Zia et al.
We present a system for recording in vivo electromyographic (EMG) signals from songbirds using hybrid polyimide-polydimethylsiloxane (PDMS) flexible multielectrode arrays (MEAs). 2-D electrodes with a diameter of 200, 125, and 50 μm and a ...
Electrical Interconnects Fabricated From Biodegradable Conductive Polymer Composites [0.03%]
由可降解导电聚合物复合材料制成的电气互连
Tao Zhang,Melissa Tsang,Lin Du et al.
Tao Zhang et al.
This study presents the development and characterization of biodegradable electrical interconnects for transient implantable medical devices. The interconnects comprised micropatterned biodegradable conductive polymer composites, which were...
Mechanical Designs for Inorganic Stretchable Circuits in Soft Electronics [0.03%]
软电子产品中无机可拉伸电路的机械设计
Shuodao Wang,Yonggang Huang,John A Rogers
Shuodao Wang
Mechanical concepts and designs in inorganic circuits for different levels of stretchability are reviewed in this paper, through discussions of the underlying mechanics and material theories, fabrication procedures for the constituent micro...
Wafer Scale Integration of CMOS Chips for Biomedical Applications via Self-Aligned Masking [0.03%]
自对准掩模CMOS芯片的晶圆级集成在生物医学中的应用
Ashfaque Uddin,Kaveh Milaninia,Chin-Hsuan Chen et al.
Ashfaque Uddin et al.
This paper presents a novel technique for the integration of small CMOS chips into a large area substrate. A key component of the technique is the CMOS chip based self-aligned masking. This allows for the fabrication of sockets in wafers th...