Naibo Zhang,Zilai Wang,Zixin Zhao et al.
Naibo Zhang et al.
In recent years, the utilization of 3D printing technology in micro and nano device manufacturing has garnered significant attention. Advancements in 3D printing have enabled achieving sub-micron level precision. Unlike conventional micro-m...
Hollow fiber-based strain sensors with desirable modulus and sensitivity at effective deformation for dexterous electroelastomer cylindrical actuator [0.03%]
具有理想模量和灵敏度的空心纤维应变传感器有效的驱动灵巧电活性聚合物圆柱执行器变形
Yang Zhang,Keqi Deng,Tingting Shen et al.
Yang Zhang et al.
The electroelastomer cylindrical actuators, a typical representation of soft actuators, have recently aroused increasing interest owing to their advantages in flexibility, deformability, and spatial utilization rate. Proprioception is cruci...
Dual-mode temperature monitoring using high-performance flexible thermocouple sensors based on PEDOT:PSS/CNTs and MXene/Bi2Se3 [0.03%]
基于PEDOT:PSS/CNTs和MXene/Bi2Se3的高性能柔性热电偶传感器的双模式温度监测
Baichuan Sun,Gaobin Xu,Zhaohui Yang et al.
Baichuan Sun et al.
Due to the limited thermoelectric (TE) performance of polymer materials and the inherent rigidity of inorganic materials, developing low-cost, highly flexible, and high-performance materials for flexible thermocouple sensors (FTCSs) remains...
Transparent, flexible graphene-ITO-based neural microelectrodes for simultaneous electrophysiology recording and calcium imaging of intracortical neural activity in freely moving mice [0.03%]
用于自由活动小鼠皮层内神经活动电生理记录和钙成像的透明柔性石墨烯-铟锡氧化物神经微电极
Miao Yuan,Fei Li,Feng Xue et al.
Miao Yuan et al.
To understand the complex dynamics of neural activity in the brain across various temporal and spatial scales, it is crucial to record intracortical multimodal neural activity by combining electrophysiological recording and calcium imaging ...
Extracting mechanical quality factor and eliminating feedthrough using harmonics of thermal-piezoresistive micromechanical resonators [0.03%]
通过热-压阻微机械谐振子的谐波提取力学品质因素和消除直通技术
Geer Teng,Chenhao Yang,Aojie Quan et al.
Geer Teng et al.
Thermal-actuation and piezoresistive-detection effects have been employed to pump the effective quality factor of MEMS resonators, targeting simple self-oscillation and better sensing performance in the air. However, the ratio of the pumped...
Design and developing a robot-assisted cell batch microinjection system for zebrafish embryo [0.03%]
用于斑马鱼胚胎的机器人辅助细胞批式显微注射系统的设计与开发
Xiangyu Guo,Antian Zhao,Youchao Zhang et al.
Xiangyu Guo et al.
The microinjection of Zebrafish embryos is significant to life science and biomedical research. In this article, a novel automated system is developed for cell microinjection. A sophisticated microfluidic chip is designed to transport, hold...
Comparative analysis of nanomechanical resonators: sensitivity, response time, and practical considerations in photothermal sensing [0.03%]
纳米机械谐振器的比较分析：光热传感中的灵敏度、响应时间和实际考虑因素
Kostas Kanellopulos,Friedrich Ladinig,Stefan Emminger et al.
Kostas Kanellopulos et al.
Nanomechanical photothermal sensing has significantly advanced single-molecule/particle microscopy and spectroscopy, and infrared detection. In this approach, the nanomechanical resonator detects shifts in resonant frequency due to photothe...
Jinxuan Xie,Tong Zhou,Yu Chen et al.
Jinxuan Xie et al.
Traditional gyrocompasses, while capable of providing autonomous directional guidance and path correction, face limitations in widespread applications due to their large size, making them unsuitable for compact devices. Microelectromechanic...
Inverted pyramid 3-axis silicon Hall-effect magnetic sensor with offset cancellation [0.03%]
具有偏移消除功能的倒金字塔三维硅霍尔效应磁传感器
Jacopo Ruggeri,Udo Ausserlechner,Helmut Köck et al.
Jacopo Ruggeri et al.
Microelectronic magnetic sensors are essential in diverse applications, including automotive, industrial, and consumer electronics. Hall-effect devices hold the largest share of the magnetic sensor market, and they are particularly valued f...
Study of the protrusion of through-silicon vias in dual annealing-CMP processes for 3D integration [0.03%]
双退火CMP工艺中TSV凸点的研究及其在三维集成中的应用研究
Tianjian Liu,Shizhao Wang,Fang Dong et al.
Tianjian Liu et al.
The technology of through-silicon via (TSV) is extensively employed for achieving dense 3D integration. TSV facilitates the electrical interconnection of various layers of integrated circuits in a vertical orientation, thereby allowing for ...