Nondestructive Testing and Evaluation. 2005;20(2):89-102. doi: 10.1080/10589750500149149 Q14.32025

Understanding and predicting electronic vibration stress using ultrasound excitation, thermal profiling, and neural network modeling

利用超声波激励、热分布分析与神经网络建模，实现电子振动应力的解析与预测

DOI: 10.1080/10589750500149149

摘要

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