IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 2013;21(6):1170-1174. doi: 10.1109/TVLSI.2012.2204781 Q23.22025

Fast Scan-Chain Ordering for 3-D-IC Designs Under Through-Silicon-Via (TSV) Constraints

Liao, Christina C.-H.; Chen, Allen W.-T.; Lin, Louis Y.-Z.; Wen, Charles H.-P.

DOI: 10.1109/TVLSI.2012.2204781

期刊名：Ieee transactions on very large scale integration (vlsi) systems

缩写：IEEE T VLSI SYST

ISSN：1063-8210

e-ISSN：1557-9999

IF/分区：3.2/Q2

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