Quality and reliability engineering international. 1994;10(3):237-242. doi: 10.1002/qre.4680100314 Q22.82025

Testing of the quality of solder joints through the analysis of their thermal behaviour with an interferometric laser probe

W. Claeys; V. Quintard; S. Dilhaire; D. Lewis; Y. Danto

DOI: 10.1002/qre.4680100314

摘要

期刊名：Quality and reliability engineering international

缩写：QUAL RELIAB ENG INT

ISSN：0748-8017

e-ISSN：1099-1638

IF/分区：2.8/Q2

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