Quality and reliability engineering international. 1986;2(3):216-216. doi: 10.1002/qre.4680020313 Q22.82025

Thermal Design of Electronic Circuit Boards and Packages, D. J. DEAN, Electrochemical Publications, 1985. No. of pages: 279. Price: £63.00/$112.00

P.D.T.O' CONNOR.

DOI: 10.1002/qre.4680020313

摘要

期刊名：Quality and reliability engineering international

缩写：QUAL RELIAB ENG INT

ISSN：0748-8017

e-ISSN：1099-1638

IF/分区：2.8/Q2

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