Journal of materials science-materials in electronics. 2007;18(1-3):247-258. doi: 10.1007/s10854-006-9026-2 Q22.82025

Electromigration statistics and damage evolution for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packages

Seung-Hyun Chae; Xuefeng Zhang; Kuan-Hsun Lu; Huang-Lin Chao; Paul S. Ho; Min Ding; Peng Su; Trent Uehling; Lakshmi N. Ramanathan

DOI: 10.1007/s10854-006-9026-2

期刊名：Journal of materials science-materials in electronics

缩写：J MATER SCI-MATER EL

ISSN：0957-4522

e-ISSN：1573-482X

IF/分区：2.8/Q2

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