Journal of materials science-materials in electronics. 2006;17(8):597-606. doi: 10.1007/s10854-006-0005-4 Q23.22025

Comparative performance of gold wire bonding on rigid and flexible substrates

刚性与柔性基板上金线键合的性能对比

Yu Hin Chan; Jang-Kyo Kim; Deming Liu; Peter C. K. Liu; Yiu Ming Cheung; Ming Wai Ng

DOI: 10.1007/s10854-006-0005-4

期刊名：Journal of materials science-materials in electronics

缩写：J MATER SCI-MATER EL

ISSN：0957-4522

e-ISSN：1573-482X

IF/分区：3.2/Q2

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