Journal of materials science-materials in electronics. 2010;21(6):608-618. doi: 10.1007/s10854-009-9965-5 Q23.22025
Investigation of the effect of solidification processing parameters on the rod spacings and variation of microhardness with the rod spacing in the Sn–Cu hypereutectic alloy
固态凝固工艺参数对Sn–Cu过共晶合金中棒状组织间距及随棒间距变化的显微硬度影响的研究
DOI: 10.1007/s10854-009-9965-5
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期刊名：Journal of materials science-materials in electronics
缩写：J MATER SCI-MATER EL
ISSN：0957-4522
e-ISSN：1573-482X
IF/分区：3.2/Q2
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Investigation of the effect of solidification processing parameters on the rod spacings and variation of microhardness with the rod spacing in the Sn–Cu hypereutectic alloy