Journal of materials science-materials in electronics. 2010;21(3):278-284. doi: 10.1007/s10854-009-9905-4 Q23.22025

Copper pillar bump design optimization for lead free flip-chip packaging

无铅倒装芯片封装中铜柱凸点设计优化

DOI: 10.1007/s10854-009-9905-4

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