Journal of materials science-materials in electronics. 2010;21(3):262-269. doi: 10.1007/s10854-009-9903-6 Q23.22025

Impression creep of the rare-earth doped Sn–2%Bi lead-free solder alloy

稀土掺杂Sn–2%Bi无铅焊料合金的蠕变性能

DOI: 10.1007/s10854-009-9903-6

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