Journal of materials science-materials in electronics. 2010;21(1):53-57. doi: 10.1007/s10854-009-9868-5 Q23.22025

Temperature measurement at flip chip solder joint during electromigration test

电迁移测试期间倒装芯片焊点的温度测量

DOI: 10.1007/s10854-009-9868-5

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