Journal of materials science-materials in electronics. 2010;21(9):917-925. doi: 10.1007/s10854-009-0018-x Q23.22025

Impact of joint materials on the reliability of double-side packaged SiC power devices during high temperature aging

接合材料对双面封装碳化硅功率器件高温老化期间可靠性的影响

Fengqun Lang; Hiroshi Nakagawa; Masahiro Aoyagi; Hiromichi Ohashi; Hiroshi Yamaguchi

DOI: 10.1007/s10854-009-0018-x

期刊名：Journal of materials science-materials in electronics

缩写：J MATER SCI-MATER EL

ISSN：0957-4522

e-ISSN：1573-482X

IF/分区：3.2/Q2

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