Interfacial Microstructure Evolution and High-Speed Ball Shear Fracture of SAC305/Cu-20wt%Zn Solder Joints Under Isothermal Aging
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The interfacial microstructure evolution and high-speed ball shear reliability of SAC305 (Sn-3.0Ag-0.5Cu)/Cu-20wt%Zn solder joints were systematically investigated after isothermal aging at 180 °C for up to 250 h. SAC305/electroless nickel immersion gold (ENI... ...
