Molecular Dynamics Study on Silane Coupling Agent Grafting to Optimize the Interfacial Microstructure and Physical Properties of Polyimide/Nano-Si3N4 Composites
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Polyimide (PI) is widely used in aerospace, electronic packaging, and other fields due to its excellent dielectric and thermophysical properties. However, the performance of traditional PI materials under extreme conditions has become increasingly inadequate t... ...