Low-Temperature In Situ Bonding with Ion-Free Neutral Species and Ammonia-Enhanced Activation for Microfluidic Chip Architecture
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With the advent of the AI era, silicon-based semiconductor material bonding has emerged as an important means to achieve optoelectronic integration and miniaturization. It is indispensable in areas such as micro/nanoelectromechanical systems (M/NEMS), Lab-on-C... ...
