Effects of Ag and melt undercooling on the microstructure of Sn-Ag solder balls
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The microstructure of electronic solder joints is created by solidification in an undercooled melt. Here, we apply the framework of solidification microstructure selection maps (SMSMs) to Sn-Ag solder balls with compositions from 0.5 to 5.0 wt.% Ag and bulk un... ...
