Microstructure evolution, IMC growth, and microhardness of Cu, Ni, Ag-microalloyed Sn-5Sb/Cu solder joints under isothermal aging
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In this work, various Cu, Ni, Ag-microalloyed Sn-5Sb/Cu joints, ordinary Sn-5Sb/Cu joints, and low-melting-point Sn-3Ag-0.5Cu (SAC305)/Cu (used for comparison) were prepared, focusing on the influence of Cu, Ni, and Ag on the microstructure evolution, interfac... ...
