Design and characterization of a package-less hybrid PDMS-CMOS-FR4 contact-imaging system for microfluidic integration
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We demonstrate a hybrid "package-less" polydimethylsiloxane (PDMS)-complementary-metal-oxide-semiconductor (CMOS)-FR4 system for contact imaging. The system embeds the CMOS image sensor directly in a PDMS layer instead of the standard chip package to support m... ...
